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This study optimize the reprogram scheme in program operation of a 3D NAND flash memory based on device-level simulations based on device-level simulations to enhance the reliability during program operation and identifies conditions that minimize the Vth distribution width without degrading other device characteristics.
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Abstract In this study, we optimize the reprogram scheme in program operation of a 3D NAND flash memory based on device-level simulations. To enhance the reliability during program operation, it is crucial to reduce the width of the threshold voltage (V th ) distribution. For this purpose, commonly used schemes in industrial practice, such as incremental step pulse programming (ISPP) and reprogram, are incorporated. The simulations utilize a physical device model and statistically consider key variability sources, including electron injection spread (EIS), random telegraph noise (RTN), and Z-interference. Furthermore, the impact of short-term retention caused by rapid electron loss in the charge trap layer (CTL) is included in program simulation and analyzed. Results of simulation are calibrated using machine learning-based data fitting. Finally, using this simulation framework, the optimization identifies conditions that minimize the V th distribution width without degrading other device characteristics, using interpolation in distribution width contour. The proposed approach is quantitatively compared with conventional methods, demonstrating significant improvement.
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@article{Lee2026Developing,
title = {Developing an ultimate 3D NAND flash memory simulation environment for operation and optimization},
author = {Jooyoung Lee and Jinil Yoo and Hyungcheol Shin},
journal = {Journal of Computational Electronics},
year = {2026},
doi = {10.1007/s10825-026-02613-5},
url = {https://doi.org/10.1007/s10825-026-02613-5}
}
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